I am troubleshooting a PC with INTEL DB D865GBF with same thermal event and freezing problem. After exhausting all options, I finally found that the thermal event / freezing only happen when the board is in the vertical position (as in a tower case). If you lay the board flat. It will work fine for days after you remove and reinsert the heat sink and CPU. After looking closer at the board, I found out that the PCB where the CPU socket is has sink down 1 mm. Since the heat sink is mount on its separate mount away from the CPU socket, the gravity actually pull the heat sink and then CPU out of the socket which can cause freezing if the thermal compound still bonding the heat sink and CPU together when the board is in a vertical position. If the thermal compound is insufficient or dried out,then it will cause a thermal event since the CPU is now unable to dissapate the heat. I have call INTEL and they said that because the board I have is OEM and therefore not supported. I have filed a compliant and waiting for the Manager to call me back.
Hi,
I'm Ravi, i have a intel P4 + intel original 865GBF Motherboard with 512 mb ram. My system is getting over heated frequently and shuts off. i have changed the thermal solution several times, still no go. i have 2 additonal fans placed in my cabinate also.
Pls give me a good solution for my problem. waiting for replys......
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